Early November, we successfully moved ASML's TWINSCAN NXT:2150i – the most advanced deep ultraviolet (DUV) immersion lithography system available today – into imec's cleanroom.
With enhanced overlay accuracy, improved critical dimension uniformity, and optimized system dynamics, the NXT:2150i supports NanoIC’s mission to push the boundaries of semiconductor scaling.
What's more, with ASML’s full product portfolio being integrated into imec’s pilot line – including High-NA EUV – NanoIC can tap into the world's most advanced infrastructure for semiconductor R&D.
While High-NA EUV will be used for the most demanding layers, the NXT:2150i will handle many less critical layers.
Offering high throughput, the tool will accelerate imec’s capacity to develop and validate new process modules at industry-relevant dimensions, shortening learning cycles and speeding up the path from idea to prototype.
Watch the video for a behind-the-scenes look at this exciting step forward in the development of the NanoIC pilot line.
Published on:
3 December 2025
