ESTC 2026
September 09 - 11, 2026 | Helsinki, Finland
The premier international event in the field of electronics packaging and system integration.
NanoIC will be participating in the 11th IEEE ISTC. The IEEE ESTC conference series is the premier venue for academics and industry to present and discuss the latest developments in electronics packaging, Covering a wide range of up-to-date topics in electronics packaging and system integration
BOOTH #34
The NanoIC Pilot Line will be represented at the exhibition with a booth. Come and find our experts to discover the latest developments of the pilot line in the field of packaging and systems integration.
PANEL
Andy Miller, Program Director at imec, will represent the NanoIC Pilot Line during the special session on Thursday 10 September at 13:45 until 15:00h. The topic of this session is 'The First Five Pilot Lines Launched Under the Chips for Europe Initiative - Where We Are, and What's Next with Respect to Advanced Packaging'.