Electronic Components and Technology Conference (ECTC) 2025
May 27 - 30, 2025 | Dallas, USA
The ECTC is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
Three of the papers that imec presents at this year's IEEE ECTC are in part enabled by NanoIC.
Xiao Sun, Siddhartha Sinha, Hamideh Jafarpoorchekab, Melina Lofrano, Vladimir Cherman, Damien Leech, and Angel Uruena from imec presents "RF Si Interposer Platform for Advanced Chiplet-Based Heterogeneous Systems". These results were also announced in a press release from imec. The flexible integration of digital, analog, RF-to-sub-THz CMOS and III/V chiplets on a single carrier paves the way for high-performance RF and mixed-signal applications. Amongst others by evaluating access via NanoIC, imec is preparing to open its RF interposer R&D platform to partners for early assessment, system validation, and prototyping.
Ye Lin, Pieter Bex, Samuel Suhard, Boyao Zhang, Fulya Ulu Okudur, Amaia Diaz De Zerio, Naveen Reddy, and Efrain Altamirano Sanchez from imec presents "2 µm Pitch Direct Die-to-Wafer Hybrid Bonding Using Surface Protection During Wafer Thinning and Die Singulation".
Koen Kennes, Pieter Bex, Ye Lin, Samuel Suhard, Dieter H. Cuypers, Alain Phommahaxay, Gerald Beyer and Eric O.L. Beyne from presented "Impact of Temporary Substrates and Adhesives on Die-to-Wafer Overlay".