Advanced PDK Workshop: Silicon Interposer, Fine-Pitch RDL, and D2W Hybrid Bonding
December 07 - 08, 2026 | imec, Leuven, Belgium
Join us for an in-depth workshop on NanoIC's three newest open-access interconnect PDKs: fine-pitch RDL, silicon interposer, and D2W hybrid bonding, co-organized by Europractice and the NanoIC pilot line.
Training information
This workshop is an opportunity to engage with imec experts developing the underlying technology and get answers to your technical questions. During the program, you can expect an introduction to the NanoIC Pilot Line project, a technical introduction to the RDL, Si Interposer and D2W PDKs, and hands-on sessions with these PDKs covering:
- Floorplanning of the 2.5D system
- Importing the floorplan into the design environment
- Routing of die-to-die signals
- Power grid design and optimization
- Routing die-to-PCB signals
- Design Rule Check (DRC)
- Layout Versus Schematic (LVS) checks of a chiplet package
Day 1: Introduction to fine-pitch RDL, D2W hybrid bonding and silicon interposer PDKs
- Nano-IC Pilot Line introduction
- Introduction to packaging
- Technical introduction to the fine-pitch RDL PDK and the D2W hybrid bonding PDK
- Introduction to silicon interposer
- Introduction to design flow for advanced interconnect packages
Day 2: Hands-on application
- Hands-on session for fine-pitch RDL PDK
- Hands-on session for D2W
- Hands-on session for Silicon interposer
Who should attend?
These lectures are suitable for students, academics, and professionals with an interest in exploring advanced packaging, interconnect technologies, and high-performance computing. Although not required, previous experience with Unix is advised.
Attendance fee
200 EUR
Date and location
The workshop will take place at imec's headquarters (imec 1, Kapeldreef 75, 3001 Leuven, Belgium) on 7 and 8 December 2026.
Registration
- Europractice members can register via the Europractice website.
- Non-Europractice members can register via imec.academy.
- Imec employees can register here through the internal portal.
Registration will close on 30 November 2026, or earlier if all available places are filled.
Important registration requirement: Before your registration can be finalized, your affiliated institution must have signed the below legal agreements with imec. These agreements are required to protect imec's intellectual property and to ensure compliant access to the PDKs and related design information used during the workshop.
Please contact our support team at imecpdk@imec.be, indicating that you would like access to the imec Fine-Pitch RDL PDK and imec D2W Hybrid Bonding PDK for training purposes. Our team will guide you through the required procedure. Please note that, depending on the country and status of the requesting institution, the access procedure may take additional time. For further information, please contact the above email address.