June 17 - 19, 2026 | Dresden, Germany
Enabling next-gen heterogeneous systems integration
This year, the 3D & Systems Summit is dedicated to Enabling Next-Gen Heterogeneous Systems Integration, focused on exploring strategies for enhancing Europe's semiconductor industry, addressing topics as geopolitical dynamics, market trends, as well as the latest advancements in chiplet applications and hybrid bonding techniques. The Summit will feature an exclusive exhibition area, showcasing industry leaders alongside innovative emerging companies. This Summit is a platform for gathering and exchange of knowledge and fostering of collaborations within the semiconductor sector.
At booth #18, NanoIC is represented by our experts to showcase our advanced 300mm capabilities enabling innovation in logic, interconnects, and memory technologies. Stop by to explore how the project aims to drive European technology leadership across critical markets such as computing, communication, mobility, energy and health.